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ClassOne Technology Expands Solstice® Single-Wafer Portfolio with New 300mm Solstice Max Platform for Advanced Packaging Metallization

New, modular Solstice Max builds on the capabilities of ClassOne's Solstice S-Series to deliver turnkey advanced electroplating and surface preparation performance for both 200mm and 300mm ...
Yahoo Finance

Samtec Orders ClassOne Technology Solstice® S8 Single-Wafer System to Process Glass Core Technology Products

KALISPELL, Mont., Sept. 11, 2024 (GLOBE NEWSWIRE) -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...
Nasdaq

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing

FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Business Wire

Tanaka Precious Metals: Electroplating Engineers of Japan Launched Semiconductor Wafer Cup-type Ultra-compact Plating Laboratory Equipment on July 15, Enabling Plating ...

TOKYO--(BUSINESS WIRE)--Tanaka Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Akira Tanae) today announced that Electroplating Engineers of Japan, Limited (Head ...
FOX8 Cleveland

Global Leader in microLED Manufacturing Orders Repeat Solstice® S8 Single-Wafer Electroplating System from ClassOne Technology

KALISPELL, Mont., Feb. 01, 2023 (GLOBE NEWSWIRE) -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...
Nasdaq

ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems

FREMONT, Calif., May 06, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Semiconductor Engineering

Electroplating IC Packages

The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...